Conformal heat spreader
US7007741B2 · kind B2 · utility
27Cited by
21References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2002 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Oct 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader apparatus for cooling an electronic component and method of attachment. The heat spreader comprises a flexible wall that partially conforms to a non-matching mating surface of the component when pressure is applied to the surface of the flexible wall that is opposite the component. The pressure may be maintained against the flexible wall during use, or released once the flexible wall is maintained in its conforming location by an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.