Contact bump construction for the production of a connector construction for substrate connecting surfaces
US7007834B2 · kind B2 · utility
3Cited by
15References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 19, 2001 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Mar 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Contact bump construction (27) and method for the production of a contact bump construction for the formation of elevated contact sites on connecting surfaces (22) of a substrate (21), particularly chip connecting surfaces, with a spacer metallization (28) for the attainment of a defined height of the contact bump construction, wherein the spacer metallization (28) consists at least partly of annealed copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.