Chemical mechanical polishing equipment and conditioning thereof
US7008302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2004 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | May 7, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing equipment has a polishing pad, a holder, a slurry supply and a conditioner. The holder is disposed above the polishing pad and carries a wafer for polishing the surface of wafer. The slurry supply is disposed above the polishing pad for supplying slurry onto the polishing surface. The conditioner is disposed near the polishing pad for removing the residual particles over the polishing pad. By disposing a plurality of block on the conditioner, the conditioner can provide with flexibility so that the conditioner can sufficiently contact with the polishing surface for increasing the removal rate of residual particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.