Patent · US Expired

Method and apparatus for joining substrates

US7008502B2 · kind B2 · utility

1Cited by

6References

9Claims

0Family size

Assignee

Steag Hamatech AG · US

Inventors

Ulrich Speer · Eisingen, DE
Roland Wagner · Feldkirchen-Westerham, DE
Stephan Leonhardt · Bretten, DE

Key dates

Filing date	Dec 13, 2001
Grant date	Mar 7, 2006
Priority date	—
Expiry date	Dec 22, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/17
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

In order to reduce cycle times for assembling at least two substrates (3,4) in order to form an optical data carrier in a low-pressure chamber (8), a method and a device are disclosed wherein an opening (11) of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, a transfer chamber (64) is formed between a first handling device (16) arranged in the low-pressure chamber and a second handling device (24) arranged outside the low-pressure chamber by respectively sealing the opening (11) of the low-pressure chamber (8). The transfer chamber (64) has a smaller volume than that of the low-pressure chamber (8); the substrates (3, 4) in the transfer chamber (64) are transferred from the second handling device (24) to the first handling device (16); the substrates are conveyed (3, 4) with the first handling device (16) to an assembly station (14) in the low-pressure chamber when low-pressure chamber is sealed by the second handling device (24), and the substrates (3,4) are assembled in the assembly station (14).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.