Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated-circuit component
US7008842B2 · kind B2 · utility
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3References
14Claims
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Assignee
Inventors
Key dates
| Filing date | May 1, 2002 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | May 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated component, in which process and component a first electrode is in the form of a cup; a layer made of a dielectric covers at least the wall of the first electrode; a second electrode fills the cup; a first electrical connection via lies above the second electrode; and a second electrical connection via lies laterally with respect to and at a predetermined distance from the first electrode and is connected to the first electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.