Semiconductor chip assembly with embedded metal particle
US7009297B1 · kind B1 · utility
131Cited by
144References
110Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2004 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Aug 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally beyond the metal particle towards the chip, and the chip and the metal particle are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.