Methods and apparatus for integrated circuit ball bonding using stacked ball bumps
US7009305B2 · kind B2 · utility
5Cited by
9References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Jun 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20754
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit comprises at least one circuit element having at least one bond site and a passivation layer. The bond site is accessible through an aperture in the passivation layer. At least two ball bumps are disposed at the bond site. A first ball bump is bonded to the bond site, and each additional ball bump is bonded on a previously bonded ball bump so that the height of the ball bumps is greater than the thickness of the passivation layer above the bond site. A ball bond is bonded to an uppermost ball bump and has a wire formed integrally therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.