Patrick Carberry
7Patents
3h-index
9Co-inventors
42Inventor score
Filing activity: Nov 5, 2003 → Oct 17, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7224047B2 | Semiconductor device package with reduced leakage | Electricity | 41 | Expired |
| US7009305B2 | Methods and apparatus for integrated circuit ball bonding using stacked ball bumps | Electricity | 5 | Expired |
| US7956451B2 | Packages for encapsulated semiconductor devices and method of making same | Electricity | 3 | Expired |
| US7541669B2 | Semiconductor device package with base features to reduce leakage | Electricity | 3 | Active |
| US7960812B2 | Electrical devices having adjustable capacitance | Electricity | 1 | Active |
| US7456716B2 | Electrical devices having adjustable electrical characteristics | Electricity | 0 | Expired |
| US7314781B2 | Device packages having stable wirebonds | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.