Feedthrough terminal assembly with lead wire bonding pad for human implant applications
US7012192B2 · kind B2 · utility
77Cited by
44References
106Claims
0Family size
Inventors
Key dates
| Filing date | Mar 30, 2005 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Mar 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/4847
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.