Scott Knappen
5Patents
5h-index
7Co-inventors
45Inventor score
Filing activity: May 10, 2004 → Apr 19, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7038900B2 | EMI filter terminal assembly with wire bond pads for human implant applications | Electricity | 156 | Expired |
| US7310216B2 | EMI filter terminal assembly with wire bond pads for human implant applications | Electricity | 123 | Expired |
| US7012192B2 | Feedthrough terminal assembly with lead wire bonding pad for human implant applications | Electricity | 77 | Expired |
| US7145076B2 | Method for minimizing stress in feedthrough capacitor filter assemblies | Emerging Cross-Sectional Technologies | 58 | Expired |
| US7623335B2 | Hermetic feedthrough terminal assembly with wire bond pads for human implant applications | Electricity | 45 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.