Device for mounting a semiconductor package on a support plate via a base
US7012331B2 · kind B2 · utility
3Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2003 |
| Grant date | Mar 14, 2006 |
| Priority date | — |
| Expiry date | Feb 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.