Method of using micro-contact imprinted features for formation of electrical interconnects for substrates
US7013562B2 · kind B2 · utility
3Cited by
4References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Oct 15, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An imprinting stamp to imprint an opening in a material layer in which the imprint stamp has a coating of a seed material. The seed material is transferred onto the surface within the opening to operate as a seed for filling the opening. In one embodiment, low surface energy material is used as a passivation layer between the imprinting surface and the seed coating to reduce adhesion during micro-contact transfer of the seed into the opening. The imprinting stamp is used to form trenches and via openings for formation of electrical interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.