Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US7014093B2 · kind B2 · utility
27Cited by
15References
24Claims
0Family size
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Key dates
| Filing date | Jun 26, 2003 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Oct 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249933
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.