Ashay Dani
26Patents
11h-index
34Co-inventors
71Inventor score
Filing activity: Oct 18, 2001 → Apr 28, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6926955B2 | Phase change material containing fusible particles as thermally conductive filler | Emerging Cross-Sectional Technologies | 33 | Expired |
| US7473995B2 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Electricity | 30 | Expired |
| US7014093B2 | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same | Emerging Cross-Sectional Technologies | 27 | Expired |
| US7846778B2 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Electricity | 18 | Expired |
| US7311967B2 | Thermal interface material and electronic assembly having such a thermal interface material | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6974723B2 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | Electricity | 17 | Expired |
| US7253523B2 | Reworkable thermal interface material | Electricity | 16 | Expired |
| US7527090B2 | Heat dissipating device with preselected designed interface for thermal interface materials | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7294394B2 | Phase change material containing fusible particles as thermally conductive filler | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7960019B2 | Phase change material containing fusible particles as thermally conductive filler | Emerging Cross-Sectional Technologies | 15 | Active |
| US6974726B2 | Silicon wafer with soluble protective coating | Electricity | 13 | Expired |
| US6841867B2 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | Electricity | 10 | Expired |
| US8701281B2 | Substrate metallization and ball attach metallurgy with a novel dopant element | Emerging Cross-Sectional Technologies | 9 | Active |
| US7332807B2 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Electricity | 8 | Expired |
| US7252877B2 | Polymer matrices for polymer solder hybrid materials | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7030483B2 | Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application | Electricity | 6 | Expired |
| US7996989B2 | Heat dissipating device with preselected designed interface for thermal interface materials | Emerging Cross-Sectional Technologies | 3 | Active |
| US8703286B2 | Polymer matrices for polymer solder hybrid materials | Emerging Cross-Sectional Technologies | 3 | Active |
| US7776657B2 | Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same | Electricity | 3 | Active |
| US9613933B2 | Package structure to enhance yield of TMI interconnections | Electricity | 1 | Active |
| US9247686B2 | Polymer matrices for polymer solder hybrid materials | Emerging Cross-Sectional Technologies | 1 | Active |
| US7967942B2 | Polymer matrices for polymer solder hybrid materials | Emerging Cross-Sectional Technologies | 1 | Active |
| US9024453B2 | Functional material systems and processes for package-level interconnects | Electricity | 1 | Active |
| US7727815B2 | Reactive gettering in phase change solders to inhibit oxidation at contact surfaces | Electricity | 0 | Expired |
| US10049971B2 | Package structure to enhance yield of TMI interconnections | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.