Marking on underfill
US7015592B2 · kind B2 · utility
9Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2004 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Sep 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A marking is formed on an underfill between a die and a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.