Thin film forming apparatus and thin film forming method
US7017637B2 · kind B2 · utility
3Cited by
5References
14Claims
0Family size
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Inventors
Key dates
| Filing date | Sep 18, 2002 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Jun 19, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.