Solder pastes for providing high elasticity, low rigidity solder joints
US7017795B2 · kind B2 · utility
15Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2004 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0215
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.