Ning-Cheng Lee
42Patents
6h-index
35Co-inventors
69Inventor score
Filing activity: Sep 20, 2001 → Jul 29, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6610559B2 | Integrated void-free process for assembling a solder bumped chip | Electricity | 29 | Expired |
| US7017795B2 | Solder pastes for providing high elasticity, low rigidity solder joints | Electricity | 15 | Expired |
| US7223557B2 | Polynucleotide encoding a TRP channel family member, TRP-PLIK2 | Chemistry; Metallurgy | 14 | Expired |
| US7435808B2 | Polynucleotides encoding novel adiponectin receptor variant, AdipoR2v2 | Chemistry; Metallurgy | 13 | Expired |
| US8348139B2 | Composite solder alloy preform | Emerging Cross-Sectional Technologies | 13 | Active |
| US7344882B2 | Polynucleotides encoding variants of the TRP channel family member, LTRPC3 | Chemistry; Metallurgy | 12 | Expired |
| US6677179B2 | Method of applying no-flow underfill | Electricity | 6 | Expired |
| US7749340B2 | Technique for increasing the compliance of lead-free solders containing silver | Performing Operations; Transporting | 3 | Active |
| US7459532B2 | Variants of the TRP channel family member, LTRPC3G | Chemistry; Metallurgy | 2 | Active |
| US11267080B2 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Electricity | 2 | Active |
| US9741676B1 | Tin-indium based low temperature solder alloy | Electricity | 2 | Active |
| US7749336B2 | Technique for increasing the compliance of tin-indium solders | Chemistry; Metallurgy | 2 | Expired |
| US7504481B2 | TRP channel family member, LTRPC3 polypeptides | Chemistry; Metallurgy | 1 | Expired |
| US7598348B2 | Adiponectin receptor variant, AdipoR2v2 | Chemistry; Metallurgy | 1 | Active |
| US9636784B2 | Mixed alloy solder paste | Emerging Cross-Sectional Technologies | 1 | Active |
| US10888958B2 | Hybrid high temperature lead-free solder preform | Performing Operations; Transporting | 1 | Active |
| US9260768B2 | Lead-free solder alloys and solder joints thereof with improved drop impact resistance | Chemistry; Metallurgy | 1 | Active |
| US9190377B2 | Metal coating for indium bump bonding | Electricity | 1 | Active |
| US9175368B2 | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability | Chemistry; Metallurgy | 1 | Active |
| US6783057B2 | Anti-tombstoning solder alloys for surface mount applications | Electricity | 0 | Expired |
| US11229979B2 | High reliability lead-free solder alloys for harsh environment electronics applications | Electricity | 0 | Active |
| US10328533B2 | Hybrid lead-free solder wire | Chemistry; Metallurgy | 0 | Active |
| US11999018B2 | SnBi and SnIn solder alloys | Performing Operations; Transporting | 0 | Active |
| US7541434B2 | Polypeptide for a TRP channel family member, TRP-PLIK2, and splice variants | Chemistry; Metallurgy | 0 | Active |
| US9017446B2 | Mixed alloy solder paste | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.