Electronic device manufacture
US7018678B2 · kind B2 · utility
38Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Mar 21, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249987
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.