Composite sacrificial material
US7018920B2 · kind B2 · utility
9Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2004 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Nov 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76808
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The composite sacrificial material includes a polymeric or oligomeric matrix with filler material mixed therein. The filler material may be particulate matter that may be used to modify one or more properties of the composite sacrificial material during semiconductor processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.