Adhesive film and tacking pads for printed wiring assemblies
US7019403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Aug 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A self supported underfill film adhesively bonds surface mount integrated circuit packages to a printed circuit board. The printed circuit board has conductive traces and exposed conductive pads on the surface. Solder paste is printed on the conductive pads, and one or more additional solder paste deposits are printed in an area outside the conductive pads to serve as tack pads for a film adhesive. The film adhesive is strategically positioned on the printed circuit board over the tack pads and near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.