Patent assignee · US · COMPANY

Freeescale Semiconductor, Inc.

5,535Patents
4,316Active
5,535Granted
62Portfolio score

Filing activity: Dec 23, 1997 → Jul 19, 2016 · 2,263 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7132360B2 Method for treating a semiconductor surface to form a metal-containing layer Chemistry; Metallurgy 570 Expired
US7575968B2 Inverse slope isolation and dual surface orientation integration Electricity 516 Active
US9165023B2 Integrated circuit device and method for determining an index of an extreme value within an array of values Physics 407 Active
US7030469B2 Method of forming a semiconductor package and structure thereof Electricity 274 Expired
US7777330B2 High bandwidth cache-to-processing unit communication in a multiple processor/cache system Electricity 263 Active
US6838776B2 Circuit device with at least partial packaging and method for forming Electricity 237 Expired
US7504302B2 Process of forming a non-volatile memory cell including a capacitor structure Electricity 229 Active
US6921975B2 Circuit device with at least partial packaging, exposed active surface and a voltage reference plane Electricity 188 Expired
US6834073B1 System and method for baseband removal of narrowband interference in ultra wideband signals Electricity 179 Expired
US6838322B2 Method for forming a double-gated semiconductor device Electricity 176 Expired
US7015075B2 Die encapsulation using a porous carrier Electricity 173 Expired
US6861689B2 One transistor DRAM cell structure and method for forming Physics 150 Expired
US7412008B2 Programmable phase mapping and phase rotation modulator and method Electricity 145 Expired
US7100020B1 Digital communications processor Electricity 138 Expired
US6835423B2 Method of fabricating a magnetic element with insulating veils Emerging Cross-Sectional Technologies 134 Expired
US6963090B2 Enhancement mode metal-oxide-semiconductor field effect transistor Electricity 129 Expired
US6774497B1 Flip-chip assembly with thin underfill and thick solder mask Electricity 129 Expired
US6792502B1 Microprocessor having a content addressable memory (CAM) device as a functional unit therein and method of operation Physics 128 Expired
US6893947B2 Advanced RF enhancement-mode FETs with improved gate properties Electricity 123 Expired
US7226833B2 Semiconductor device structure and method therefor Electricity 122 Expired
US7119381B2 Complementary metal-oxide-semiconductor field effect transistor structure having ion implant in only one of the complementary devices Electricity 121 Expired
US7058414B1 Method and system for enabling device functions based on distance information Electricity 113 Expired
US7042765B2 Memory bit line segment isolation Physics 108 Expired
US8115499B2 Device with proximity detection capability Emerging Cross-Sectional Technologies 108 Active
US7344917B2 Method for packaging a semiconductor device Electricity 107 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.