Electrostatic chuck having bonded structure and method of manufacturing the same
US7019956B2 · kind B2 · utility
12Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2002 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Feb 14, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/27
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An electrostatic chuck and a method for manufacturing the same are provided. The electrostatic chuck has a bonded structure comprising a ceramic electrostatic chuck member, a metal member and a bonding layer. The bonding layer has at least a first outermost bonding layer joined to the ceramic electrostatic chuck member, a second outermost bonding layer joined to the metal member, and an intermediate polyimide layer disposed between the first and second outermost bonding layers. Each of the outermost bonding layers are made of a silicone layer or an acrylic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.