Heat dissipating device having improved fastening structure
US7019979B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 21, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Sep 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.