Apparatus and method for mounting component
US7020953B2 · kind B2 · utility
13Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2001 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Sep 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53187
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.