Apparatus for placing a semiconductor chip as a flipchip on a substrate
US7020954B2 · kind B2 · utility
2Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2002 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jan 16, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.