Surface treating device and surface treating method
US7023002B2 · kind B2 · utility
6Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2004 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jul 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Installed in a vacuum chamber is a mounting table for supporting semiconductor wafer, which is a substrate to be treated, with an electron beam irradiation mechanism mounted on the ceiling of the vacuum chamber for generating electron beams. The mounting table is adapted to be vertically moved by a lifting/lowering device, allowing the distance between the electron beam irradiating mechanism and the semiconductor wafer to be set at a desired value. This makes it possible to perform a uniform satisfactory treatment over the entire surface of the substrate to be treated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.