Patent · US Expired

Semiconductor component arrangement with a reduced oscillation tendency

US7023086B2 · kind B2 · utility

2Cited by

0References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bernd Gutsmann · Weyhe, DE
Paul Mourick · Ergolding, DE
Gerhard Miller · Landsberg am Lech, DE
Dieter Silber · Eschborn, DE

Key dates

Filing date	Nov 20, 2002
Grant date	Apr 4, 2006
Priority date	—
Expiry date	Dec 7, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention relates to a circuit assembly with at least two semiconductor components, each having terminals, whereby at least one terminal of the first semiconductor component is connected to a terminal of the other semiconductor component in an electrically conductive manner. The circuit assembly damps high-frequency oscillations that occur during switching operations. An eddy-current damping structure is provided above said assembly at a distance from the semiconductor components or said semiconductor components are directly connected to each other by means of a high-resistance wire connection in addition to the existent electroconductive connection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.