System and method of measuring thermal expansion
US7025498B2 · kind B2 · utility
114Cited by
38References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 30, 2003 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | May 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/682
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chuck having a high specific stiffness and high thermal conductivity compared to conventional chucks, with an apparatus for measuring thermal expansion in the chuck. High specific stiffness allows for a higher control bandwidth and improved scanning performance. High thermal conductivity enables excellent positioning accuracy because thermal expansion and strain may be accurately measured or predicted, and thus compensated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.