Fluid-ejection devices and a deposition method for layers thereof
US7025894B2 · kind B2 · utility
12Cited by
34References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2003 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Nov 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/03
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Atomic layer deposition forms a cavitation layer of a print head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.