Samson Berhane
6Patents
4h-index
12Co-inventors
46Inventor score
Filing activity: Jul 29, 2002 → Apr 29, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6716737B2 | Method of forming a through-substrate interconnect | Electricity | 81 | Expired |
| US7025894B2 | Fluid-ejection devices and a deposition method for layers thereof | Performing Operations; Transporting | 12 | Expired |
| US6902872B2 | Method of forming a through-substrate interconnect | Electricity | 5 | Expired |
| US7517060B2 | Fluid-ejection devices and a deposition method for layers thereof | Performing Operations; Transporting | 5 | Active |
| US7432582B2 | Method of forming a through-substrate interconnect | Electricity | 3 | Expired |
| US8333459B2 | Printing device | Emerging Cross-Sectional Technologies | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.