Method of fabricating microstructures and devices made therefrom
US7026184B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2003 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Feb 14, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0235
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods of fabricating micromachined devices are disclosed, as are micromachined (MEMS) devices fabricated using such methods. According to one embodiment, the method includes forming a composite thin film layer stack on a substrate such that composite thin film layer stack comprises a plurality of etch-resistant layers, directionally etching a first portion of the composite thin film layer stack selectively masked by a first etch-resistant layer thereof, and directionally etching a first portion of the substrate selectively masked by the first etch-resistant layer. These steps may result in the formation of a composite thin film microstructure. The method further includes isotropically etching a second portion of the substrate for a controlled period of time to remove substrate material from under the composite thin film microstructure, removing a portion of the first etch-resistant layer and directionally etching a second portion of the composite thin film layer stack selectively masked by a second etch-resistant layer, and directionally etching a third portion of the substrate selectively masked by the second etch-resistant layer to define a second microstructure, the second mic…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.