Terminal land frame and method for manufacturing the same
US7026192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2002 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Jun 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A terminal land frame includes a frame body and a plurality of lands. Each of these lands is formed out of the frame body to be connected to the frame body via a thinned portion and protrude therefrom. When the lands are pressed in a direction in which the lands protrude from the frame body, the thinned portions are fractured and the lands are easily separable from the frame body. A semiconductor chip is mounted on some of the lands of the terminal land frame, and the chip, wires, etc. are single-side-molded with a resin encapsulant. Thereafter, when the lands are pressed on the bottom, the lands are separated from the frame body. As a result, a structure, in which the lower part of each of these lands protrudes downward from the lower surface of the resin encapsulant, is obtained, and protruding portion is used as an external electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.