Hermetic electric component package
US7026223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2002 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Jul 12, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one conductive via extending therethrough, allowing control and/or input/output (I/O) ports associated with the electric component to be coupled to the conducive vias to pass signals between the sealed cavity and the exterior of the package without passing through the junction between the base and lid. The electric component package can be produced at the wafer level using conventional silicon wafer integrated circuit manufacturing machinery prior to separating the wafer into a plurality of devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.