Adhesive compound and method for forming photoresist pattern using the same
US7026497B2 · kind B2 · utility
1Cited by
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20Claims
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Key dates
| Filing date | Jan 12, 2005 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Jan 12, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0751
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An adhesive compound for use during the formation of a photoresist film represented by the following chemical formula, wherein R represents a photoacid generator is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.