Molded package for micromechanical devices and method of fabrication
US7026710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2001 |
| Grant date | Apr 11, 2006 |
| Priority date | — |
| Expiry date | Jan 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
According to the present invention, a plastic land-grid array package, a plastic ball-grid package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by placing a sheet-like protector on the surface of the components during the molding phase, selectively encapsulating the bonding pads and coupling members of the chip while leaving empty space above the components, removing the protector and attaching a lid over the components. A molding method as well as a molding apparatus are provided compatible with the sensitivity of the micromechanical devices, yet flexible with regard to the technique used to assemble the chip and the substrate. Furthermore, the method disclosed is flexible with regard to the material and the properties of the substrate. The invention is applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In a key embodiment of the invention, the micromechanical components are micromirrors for a digital mirror device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.