Patent · US Expired

Method and arrangement for transporting and inspecting semiconductor substrates

US7028565B2 · kind B2 · utility

4Cited by

11References

3Claims

0Family size

Assignee

Leica Microsystems Jena GmbH · DE

Inventors

Andreas Birkner · Jena, DE
Frank Bernhardt · Eppelheim, DE
Knut Hiltawski · Saalfeld, DE

Key dates

Filing date	Feb 2, 2004
Grant date	Apr 18, 2006
Priority date	—
Expiry date	Jun 24, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67748
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.