Method and apparatus for transferring a thin plate
US7029224B2 · kind B2 · utility
6Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Nov 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/20335
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for transferring a thin plate is provided, in which three or more grasping claws of a transfer arm grasp the periphery of the thin plate in order to transfer it to a predetermined transfer position, and three or more holding claws hold the periphery of the thin plate in the transfer position. The transfer arm rotates about a shaft which is in a direction of a vector sum of a first vector perpendicular to a surface of the thin plate before transfer, and a second vector perpendicular to the surface of the thin plate after the transfer, to transfer the thin plate with changing the posture thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.