Lead-free solder alloy
US7029542B2 · kind B2 · utility
5Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Jan 18, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.