Method for cutting a block of material and forming a thin film

US7029548B2 · kind B2 · utility

Assignee

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Bernard Aspar · Voiron, FR
• Chrystelle Lagache · Douchy-les-Mines, FR

Key dates

• Filing date: Jul 11, 2001
• Grant date: Apr 18, 2006
• Expiry date: Jul 11, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1967
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process for cutting out a block of material includes a step of introducing ions in the block thereby forming an embrittled zone and defining at least one superficial part of the block. The method also includes a step of forming at least one separation initiator at the level of the embrittled zone, wherein the step of forming the separation initiator includes implanting ions of an ionic nature different from that introduced during the preceding step. The method further includes a step of separating at the level of the embrittled zone the superficial part of the block from a remaining part of the block from the separation initiator, wherein the separation step includes at least one of a thermal treatment and the application of mechanical forces acting between the superficial part and the embrittled zone.