Optical semiconductor device
US7030477B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2005 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Feb 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laser device includes a can package of a laser diode having a lead terminal secured to a through hole in a stem by a sealant, and a flexible substrate having a transmission line on a front surface of a polyimide film. The lead terminal of the can package and one end of a transmission line of the flexible substrate are connected by soldering. A resistor for matching the impedance of the transmission line and the impedance of the lead terminal is located in the vicinity of a connection of the transmission line and the lead terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.