Method and device with variable resilience springs for testing integrated circuit packages
US7030638B2 · kind B2 · utility
10Cited by
4References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Jul 24, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0466
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.