Method and structure for cooling a dual chip module with one high power chip
US7031162B2 · kind B2 · utility
58Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Mar 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.