Inventor · Poughkeepsie, NY, US

Kamal K. Sikka

85Patents
11h-index
92Co-inventors
81Inventor score

Filing activity: Sep 30, 1999 → Feb 16, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6294408A Method for controlling thermal interface gap distance Electricity 87 Expired
US7031162B2 Method and structure for cooling a dual chip module with one high power chip Electricity 58 Expired
US7516776B2 Microjet module assembly Emerging Cross-Sectional Technologies 56 Active
US7928562B2 Segmentation of a die stack for 3D packaging thermal management Electricity 49 Active
US8299608B2 Enhanced thermal management of 3-D stacked die packaging Electricity 47 Active
US7992627B2 Microjet module assembly Emerging Cross-Sectional Technologies 46 Active
US6292367A Thermally efficient semiconductor chip Electricity 22 Expired
US11164817B2 Multi-chip package structures with discrete redistribution layers Electricity 20 Active
US7812438B2 Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging Electricity 19 Active
US9089052B2 Multichip module with stiffening frame and associated covers Electricity 12 Active
US10553522B1 Semiconductor microcooler Electricity 12 Active
US9401315B1 Thermal hot spot cooling for semiconductor devices Electricity 11 Active
US7768121B2 Apparatus and methods for cooling semiconductor integrated circuit package structures Electricity 10 Active
US7875972B2 Semiconductor device assembly having a stress-relieving buffer layer Electricity 9 Active
US7250576B2 Chip package having chip extension and method Electricity 9 Expired
US7733655B2 Lid edge capping load Emerging Cross-Sectional Technologies 9 Active
US9366591B2 Determining magnitude of compressive loading Physics 9 Active
US10541156B1 Multi integrated circuit chip carrier package Electricity 8 Active
US7319591B2 Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Emerging Cross-Sectional Technologies 5 Expired
US9089051B2 Multichip module with stiffening frame and associated covers Electricity 5 Active
US10172258B2 Cooling structure for electronic boards Electricity 5 Active
US9437515B2 Heat spreading layer with high thermal conductivity Electricity 5 Active
US8232636B2 Reliability enhancement of metal thermal interface Electricity 5 Active
US9721870B2 Cooling structure for electronic boards Electricity 5 Active
US7288839B2 Apparatus and methods for cooling semiconductor integrated circuit package structures Electricity 5 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.