Carrier head for chemical mechanical polishing
US7033257B2 · kind B2 · utility
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22References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2004 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Jul 21, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to the wear ring. This degree of freedom can accommodate height dimensional changes that may occur in the wear ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.