Apparatus for electrochemically depositing a material onto a workpiece surface
US7033464B2 · kind B2 · utility
4Cited by
26References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2002 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | May 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multi-process workpiece apparatus is disclosed. The multi-process workpiece apparatus includes an electrochemical deposition apparatus which has a wafer contacting surface having at least one electrical conductor disposed therein. The multi-process workpiece apparatus also includes a planarization apparatus and at least one workpiece handling robot configured to transport a workpiece from the electrochemical deposition apparatus to the planarization apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.