Method of forming segmented ball limiting metallurgy
US7033923B2 · kind B2 · utility
12Cited by
11References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 10, 2005 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Feb 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a novel layout and process for a device with segmented BLM for the I/Os. In a first embodiment, each BLM is split into two segments. The segments are close to each other and connected to the same overlying bump. In a second embodiment, each BLM is split into more than two segments. In a third embodiment, each segment is electrically connected to more than one underlying via. In a fourth embodiment, each segment is electrically connected to more than one underlying bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.