Semiconductor multipackage module including processor and memory package assemblies
US7034387B2 · kind B2 · utility
69Cited by
14References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2003 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Jul 14, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor multi-package module includes a processor and a plurality of memory packages mounted on a surface of the multipackage module substrate. In some embodiments the memory packages include stacked die packages, and in some embodiments the memory packages include stacked memory packages. In some embodiments the processor is situated at or near the center of the multipackage module substrate and the plurality of memory packages or of stacked memory package assemblies are situated on the multipackage module substrate adjacent the processor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.