Combined multilayer and single-layer capacitor for wirebonding
US7035080B1 · kind B1 · utility
8Cited by
17References
25Claims
0Family size
Inventors
Key dates
| Filing date | Nov 22, 2004 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Dec 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate includes a single-layer capacitor and various external contacts. A first external contact provides a first electrical connection to the single-layer capacitor. A second external contact provides a second electrical connection to the single-layer capacitor. The first and third external contacts are electrically connectable to another electrical component, and internal metallization structures or vias of conductive material electrically connect the second contact and the third contact to facilitate the single-layer capacitor being connectable in a parallel circuit with the other electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.