Method for producing a wafer interposer for use in a wafer interposer assembly
US7036218B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 24, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Aug 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for producing a wafer interposer (210) for use in a wafer interposer assembly is disclosed. The wafer interposer (210) is produced by attaching solder bumps (140) to a lower surface of a support (120). First electrical terminals (130) are attached to an upper surface of the support (120) and substantially correspond to the solder bumps (140). First electrical pathways are provided that passes through the support (120) and connect the solder bumps (140) to the first electrical terminals (130). Second electrical terminals (310) are attached to the upper surface of the support (120). Second electrical pathways (320) connect the first electrical terminals (130) to the second electrical terminals (310).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.